GEMBIRD Thermal Paste syringe 1.5gr

Brand: Gembird | Model: TG-G1.5-01 | Features: - Thermal paste for heat sinks - Aids heat dissipation of CPU, chipset or processor - Non-capacitive and non-electrically conductive - Excellent stability, no separation or migration - Thermal conductivity: > 4.5 W/m·K - Thermal impedance: < 0.205 °C-in²/W - Density: > 2.5 - Evaporation: < 0.001% - Volatility: < 0.005% - Dielectric constant: > 5.1 - Dissipation factor: < 0.005 - Viscosity: 76 CPS - Thixotropic index: 310 ± 10 °C - Operating temperature: -50 to 240 °C | Composition - 50% silicone compounds - 30% carbon - 20% metal oxide compounds | Weight - 1.5 g | Revision date: 01-06-2026 by IS